Turnkey Thermal Imaging Module – TCM10K25D

Description

The TCM10K25D infrared thermal camera module is a compact 120×90 uncooled imaging solution designed for ultra-low-power applications. Despite its miniature size, it integrates a highly sensitive VOx infrared detector and a new image-processing engine that delivers stable thermal imaging even in challenging environments such as night, strong light, low light, fog, smoke, light rain, snow, or haze.

Its lightweight design makes it ideal for embedded systems, consumer devices, and low-cost integrator applications. The module also supports customizable FOV lens options, allowing flexibility for different usage scenarios.

Technical Information

Product ID	TCM10K25D
Sensor	WLP VOx uncooled detector
Spectral Band	8μm ~ 14μm
Image Pixels & Resolution	120(W) × 90(H)
Pixel Pitch	17μm
Frame Rate	25fps @ 120×90
Thermal Sensitivity (NETD)	≤60mK @ 25°C
Data Interface	SPI / DVP
Measuring Range	Industrial: -20°C ~ +150°C, +100°C ~ +400°C (low gain)
Operating Temperature	-40°C ~ +70°C
Operating Voltage	DC 3.3V / 5V
Power Consumption	<45mW
Dimensions	50° lens: 8.5mm × 8.5mm × 9.2mm 90° lens: 12mm × 10mm × 5.6mm
Weight	≈2g
Lens Options(FOV)	50° / 90°

Disclaimer: Product images and specifications are for reference only and may be updated without prior notice. Please contact us for the latest information.

Turnkey Thermal Imaging Module – TCM10K25D

FEATURES

WLP VOx infrared sensor 120x90 pixels
Spectral Band: 8μm ~14μm
Thermal Sensitivity(NETD): <60mK @25°C
Frame Rate: 20Hz for 10K(120(H)x90(V))
SDK support: Windows

Datasheet

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